| Items |
Manufacturing Capability |
| Layer Count |
|
26 Layers (Max.) |
| Dimension |
Max. PCB Size |
500mm*590mm |
| Min. Thickness |
1 & 2 Layers |
0.2mm |
| 4 Layers |
0.4mm |
| 6 Layers |
0.6mm |
| 8 Layers |
0.8mm |
| 10 Layers |
1.0mm |
| 12 Layers |
1.2mm |
| Material |
FR4 94-V0 (Standard) |
TG140,TG150,TG180,TG200 |
Rogers |
4000 series |
| MCPCB |
Aluminium (Single layer) |
Copper
|
Inner Layer |
4oz (Max.) |
| Inner Layer |
0.5oz (Min.) |
| Out Layer |
5 oz (finished / Max.) |
| Out Layer |
0.3 oz (base copper / Min.) |
| Inner Board |
Thinnest inner layer (excluding copper) |
3mil (0.075mm) |
| Copper (oz) |
0.5oz |
| Inner Layer |
Annular Ring |
6mil (Min.) |
| Distance from drill hole to inner wire |
6mil (Min.) |
| Inner Layer Etching |
Alignment registration |
±3mil |
| Inner line width tolerance |
±20% |
| Drilling |
Diameter |
0.15mm (Min.) |
| Deviation |
±3mil |
| PTH tolerance |
±3mil，press fit hole ±2mil |
| N-PTH tolerance |
±2mil |
| Copper Plating |
Copper surface |
1oz |
| Hole copper |
0.8mil |
| Out Layer Etching |
Line width tolerance |
±20% |
| Soldermask |
Color |
Red / Green / Blue / Yellow / White / Purple / Black |
| Min. Soldermask Dam |
3mil / 4mil (for Black & White) |
| Soldermask Pad |
0.2mm |
| Thickness (top and bottom limit) |
0.01mm~0.0254mm (double coating) |
| Plug hole diameter |
0.5mm (Max.) |
| Through hole (plug hole) |
Soldermask ink as plug hole |
| Registration |
0.05mm |
| Silkscreen |
Color |
Yellow / White / Black |
| Deviation |
±0.127mm |
| Silkscreen Width Dam |
0.1mm (partial / Min.) |
| Height / width |
0.8mm (Min.) |
| Electrical Testing |
AOI / Flying Probe Test |
YES |
| Open / Short circuit |
YES |
| Impedance Control |
Single-ended impedance control 2L |
YES |
| Single-ended impedance control 4L |
YES |
| Single-ended impedance control 6L |
YES |
| Single-ended impedance control 8L |
YES |
| Differential impedance control |
YES |
| Forming |
Forming reaming |
± 0.127mm |
| CNC tolerance |
± 0.127mm |
| V-Cut depth |
1/3 thickness |
| V-Cut angle |
30 / 45 / 60 degrees (standard 30 degrees) |
| V-Cut deviation |
±0.1mm |
| Half round hole |
YES |
| Wire Configuration |
Between SMD line and line center |
0.4mm (Min.) |
| SMD PAD line width |
0.2mm (Min.) |
| Between BGA PAD and VIA hole edge |
0.2mm |
| Hot Air Solder Leveling (HASL) |
Thickness |
120u" |
| Vertical HASL |
YES |
| Horizontal HASL |
NO |
| Surface Treatment |
Lead-free HASL |
YES |
| Immersion Ni/Au |
YES |
| Immersion Ag |
YES |
| OSP (ENTEK) |
YES |
| Plated Ni/Au |
YES |
| Other |
UL |
V0-1、V0-7 |
| Date Code |
YYWW or WWYY |
| Inner Layer |
Min. Line / Spacing (0.5oz) |
3mil / 3mil |
| Min. Line / Spacing (1oz) |
3mil / 3mil |
| Min. Line / Spacing (2oz) |
5mil / 6mil |
| Min. Line / Spacing (3oz) |
8mil / 9mil |
| Min. Line / Spacing (4oz) |
12mil / 12mil |
| Line width tolerance |
±20% |
| Out Layer |
Min. Line / Spacing (1oz) |
3mil / 3.5mil |
| Min. Line / Spacing (2oz) |
5mil / 6mil |
| Min. Line / Spacing (3oz) |
8mil / 9mil |
| Min. Line / Spacing (4oz) |
12mil / 12mil |
| Min. Line / Spacing (5oz) |
15mil / 15mil |
| Line width tolerance |
±20% |
