Scalable Embedded Computer PCB

1.Product Positioning & Application Fields

• Scalable embedded computers are high-stability, high-reliability computing platforms specifically designed to meet the diverse demands of industrial environments and AIoT intelligent applications.
  
• They offer flexible integration of image recognition, AI accelerator cards, wireless modules, and data transmission interfaces.These systems are widely used in Industry 4.0, smart cities, AI vision systems, and automation control scenarios.

2. Key Features of the Product Series Include:

• Modular architecture
  
• Long-term supply support
  
• Outstanding computing stability
  
• Flexible integration with various I/O interfaces (PCIe, Mini PCIe, M.2, SATA, USB, LAN, etc.)
  
• Customizable expansion modules

3.Structural Characteristics

• The hardware typically adopts a 6 to 12-layer PCB stack-up
  
• Designed for long-term stability, high thermal resistance (Tg ≥ 170°C), vibration tolerance, and overall system reliability.
  
• The PCB design is usually compliant with IPC Class 2/3 standards, supporting precise impedance control, SI/PI simulation validation, and advanced fabrication processes such as back drilling and laser drilling.

4.Electrical Performance & Key Parameters
Since embedded computers are often deployed in field equipment or edge computing nodes for extended periods, they demand excellent EMC (electromagnetic compatibility), signal transmission stability, and long-term material durability.Commonly used materials include FR4 TG180, EM-825, TU-668, and N4000-13EPSI, with dielectric loss (Df) values strictly controlled under 0.006 to 0.008 to ensure signal integrity and low distortion during high-speed data transmission.