High-Speed PCB Solutions for Networking Devices

Networking & Communication

High-speed, high-frequency PCBs enabling reliable data transmission and network performance.

High Frequency PCB for Telecom & Networking Systems

Precision-engineered PCB solutions for 5G infrastructure, RF modules, and high-speed networking — where signal integrity is non-negotiable.

Material Selection

Choose low-loss laminates

Thermal Management

Ensure heat dissipation for reliability

Signal Integrity

Minimize reflections and crosstalk

Impedance Control

Design controlled trace geometries

The Challenge of High-Frequency PCB Design

As frequencies climb and data rates accelerate, even small design compromises become critical failures. Telecom PCBs face three fundamental engineering obstacles:

Signal Loss

Dielectric absorption and conductor surface roughness cause measurable insertion loss at high frequencies, degrading link budgets.

Impedance Instability

Trace width tolerances, material variability, and via transitions create impedance discontinuities that degrade signal integrity.

Crosstalk & EMI

Dense routing and mixed-signal environments amplify inter-trace coupling and radiated emissions, complicating compliance.

Core Manufacturing Capabilities

2–26 Layer PCB

From compact RF modules to complex backplane architectures — precision layer builds for every system requirement.

Controlled Impedance

Tight ±5% impedance tolerances achieved through TDR verification and process-controlled etching.

High-Speed Digital PCB

Differential pair routing, length matching, and via stub minimization for SerDes, DDR, and multi-gigabit interfaces.

RF / Microwave PCB

Low-loss substrate fabrication optimized for antenna feeds, power amplifiers, and frequency-critical RF paths.

Advanced Material Selection

Material choice defines electrical performance. We work with the industry's leading high-frequency substrates to match your application's loss tangent, Dk stability, and thermal requirements.

Rogers 4350B / 4003C

Stable Dk, low loss — the go-to for RF and microwave designs up to 40 GHz.

PTFE / Teflon

Ultra-low dielectric loss for mm-wave and high-power RF applications demanding minimal signal attenuation.

Low-Loss Dielectric Laminates

Cost-effective alternatives including Megtron 6 and IS410 for high-speed digital designs above 10 Gbps.

Engineering Support -From Stack to Signal

Our engineering team engages at every phase — from initial stackup consultation through final design validation — so your layout decisions are backed by fabrication expertise.

Stackup Design

Custom layer configurations balancing impedance targets, crosstalk budgets, and manufacturing yield.

Signal Integrity Optimization

Pre-layout guidance on trace geometry, via design, and return path continuity to meet your BER targets.

Material Selection Guidance

Application-matched substrate recommendations aligned with frequency, thermal, and cost constraints.

Why High-Frequency Fabrication Expertise Matters

Impedance Tolerance

Verified by TDR testing on every controlled-impedance build.

Max Layer Count

Supporting the most complex telecom backplane and switch fabric designs.

Frequency Capability

Material and process expertise extending into mmWave territory.

Electrical Testing

Full netlist verification on high-speed and RF boards before shipment.

Telecom & Networking Applications

5G Base Stations

Massive MIMO antenna arrays and remote radio units requiring ultra-low-loss RF performance across sub-6 GHz and mmWave bands.

Networking Equipment

High-speed router and switch backplanes handling 100G/400G Ethernet with stringent differential impedance requirements.

RF Modules

Compact, high-density RF front-end modules for LTE, 5G NR, and satellite communication systems.

Antenna Systems

Phased array and patch antenna substrates demanding precise dielectric constant uniformity across the full panel.

Ready to Spec Your COMMS PCB?

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