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A04-G001OCX
5G SA Base Station Simulator
- PCB Material Grade: Very low loss
- PCB Material Selection: EM-891
- PCB Special Process: HDI blind/buried vias + back drill
- PCB Thickness: 3.0 MM
- PCB Copper Thickness: Special copper thickness
- PCB Trace Design: 3.6 mil/4 mil
- PCB Application: Network communication products
- Complies with IPC-6012 Class 2/3 requirements
A04-G004OCX
5G Standalone Network Simulator
- PCB Material Grade: Very low loss
- PCB Material Selection: EM-528
- PCB Special Process: HDI Blind/Buried vias + Back Drill
- PCB Thickness: 3.2 MM
- PCB Copper Thickness: Special copper thickness
- PCB Circuit Design: 3.4 mil/4 mil
- PCB Application: Network communication products
- Complies with IPC-6012 Class 2/3 requirements
A35-C009-EX
Thin Client Computer and Server
- PCB Material Grade: Standard loss
- PCB Material Selection: EM-825 / TU-662 / TU-668 / IT-158 / NP155F / IS-400
- PCB Special Specification
- PCB Thickness: 1.6 MM
- PCB Copper Thickness: Special copper thickness
- PCB Circuit Design: 3.5 mil / 3.5 mil
- PCB Application: Networking and communication products
- Meets IPC-6012 Class 2/3 Requirements
A57-B007HCX
Industrial-grade Motherboard
- PCB Material Grade: Upper Middle Loss
- PCB Material Selected: TU-862HF
- PCB Thickness: 1.8 MM
- PCB Copper Thickness: 1 oz
- PCB Circuit Design: 3.0 mil / 3.5 mil
- PCB Application: Networking and Communication Products
- Compliant with IPC-6012 Class 2/3 Standards
A57-C001KEG
Embedded Single Board Computer (SBC)
- PCB Material Grade: Very low loss
- PCB Material Selection: TU-883A
- PCB Special Process: Back drilling
- PCB Thickness: 2.3 MM
- PCB Copper Thickness: 1 oz
- PCB Circuit Design: 3.5 mil / 3.4 mil
- PCB Application: Networking and communication products
- Meets IPC-6012 Class 2/3 Requirements
G16-A061WCG
Audio & Video Signal Converter and Distributor
- PCB Material Grade: Standard loss
- PCB Material Selection: EM-825/TU-662/TU-668/IT-158/NP155F/IS-400
- PCB Special Process: No conductive gold fingers
- PCB Thickness: 1.6MM
- PCB Copper Thickness: 1 oz
- PCB Circuit Design: 3.9 mil/ 3.2 mil
- PCB Usage: Network Communication Products
- Compliant with IPC-6012 Class 2/3 Requirements
L35-B003KSX
Network communication equipment
- PCB Material Grade: Ultra low loss
- PCB Material Selection: TU-883SP
- PCB Special Process: Back drilling
- PCB Thickness: 2.5 MM
- PCB Copper Thickness: Special copper thickness
- PCB Circuit Design: 4.1 mil/4.5 mil
- PCB Application: Networking and communication products
- Meets IPC-6012 Class 2/3 Requirements
P14-4001BCX
Continuous Glucose Monitoring System
- PCB Material Grade: Upper middle loss
- PCB Material Selection: IS-185HR ISOLA
- PCB Special Process: HDI blind/buried via + Vacuum Resin Plugged Via (VIP)
- PCB Thickness: 0.8 MM
- PCB Copper Thickness: 1 oz
- PCB Trace Design: 4.7 mil/ 4.5 mil
- PCB Application: Glycemic Control Analysis
- Complies with IPC-6012 Class 2/3 requirements
Q05-8110VCG
Gaming Computer and Industrial Control Monitor
- PCB Material Grade: Standard loss
- PCB Material Selection: EM-825 / TU-662 / TU-668 / IT-158 / NP155F / IS-400
- PCB Special Process: Vacuum Resin Plugged Hole (VIP)
- PCB Thickness: 1.6 MM
- PCB Copper Thickness: 1 oz
- PCB Trace Design: 3.5 mil / 3.5 mil
- PCB Application: Entertainment / Gaming Equipment
- Compliant with IPC-6012 Class 2/3 Requirements
Q05-8112HCX
Gaming Platform and Display
- PCB Material Grade: Upper middle loss
- PCB Material Selection: EM-370(Z) Halogen-free Substrate
- PCB Thickness: 1.6 MM
- PCB Copper Thickness: 1 oz
- PCB Trace Design: 3.5 mil / 3.5 mil
- PCB Application: Entertainment / Gaming Equipment
- Compliant with IPC-6012 Class 2/3 Requirements
S52-4223-LX
CNC Industrial Controller
- PCB Material Grade: Standard Loss / Mid Loss
- PCB Material Selected: High Tg (150°C), high thermal stability (Td ≥ 325°C), low Z-axis expansion CTE ≤ 3.5%
- PCB Thickness: 0.8 MM
- PCB Copper Thickness: 1 oz
- PCB Trace Design: 4.7 mil/ 4.5 mil
- PCB Application: Industrial and Instrumentation Use
- Meets IPC-6012 Class 2/3 Requirements
S52-4228-LX
CNC System Module
- PCB Material Grade: Standard Loss / Mid Loss
- PCB Material Properties: High Tg (150°C), High Thermal Stability (Td ≥ 325°C), Low Z-axis Expansion CTE ≤ 3.5%
- PCB Thickness: 2.0 MM
- PCB Copper Thickness: 2 oz
- PCB Trace Design: 7.8 mil/ 6.0 mil
- PCB Application: Industrial and Instrument Applications
- Complies with IPC-6012 Class 2/3 Requirements
T55-6034HCX
Cable Broadband Amplifier
- PCB Material Grade: Very low loss
- PCB Material Selection: TU-883C Halogen-free Substrate
- PCB Special Process: Edge Plating
- PCB Thickness: 1.8 MM
- PCB Copper Thickness: 1 oz
- PCB Trace Design: 8 mil / 5 mil
- PCB Application: Network Communication Products
- Compliant with IPC-6012 Class 2/3 Requirements
T55-6035HCX
Cable TV Signal Amplifier
- PCB Material Grade: Very low loss
- PCB Material Selection: TU-883 Halogen-free Substrate
- PCB Thickness: 1.8 MM
- PCB Copper Thickness: 1 oz
- PCB Trace Design: 8 mil / 5.5 mil
- PCB Application: Network Communication Products
- Compliant with IPC-6012 Class 2/3 Requirements
U15-8049-EX
5G Wireless Router
- PCB Material Grade: Standard loss
- PCB Material Selection: EM-825/TU-662/TU-668/IT-158/NP155F/IS-400
- PCB Special Process: HDI blind & buried vias + Vacuum Resin Plugged VIP
- PCB Thickness: 0.8 MM
- PCB Copper Thickness: 1 oz
- PCB Circuit Design: 4.7 mil/ 4.5 mil
- PCB Application: Networking and communication products
- Meets IPC-6012 Class 2/3 Requirements
C55-6159WEG
Industrial-Grade Routing Platform PCB
- PCB Material Grade: Ultra Low Loss
- PCB Material Used: EM-890
- PCB Special Process: Finger Contact without Conductive Traces
- PCB Thickness: 1.6 MM
- PCB Copper Thickness: 1 oz
- PCB Circuit Design: 4.9 mil / 4.1 mil
- PCB Applications: Industrial Computer Products, Network Communication Products
- Meets IPC-6012 Class 2/3 Requirements
C55-8155KSX
IPC Network Communication Module PCB
- PCB Material Grade: Low Loss
- PCB Material Used: EM-863+
- PCB Special Process: Back Drilling
- PCB Thickness: 1.6 MM
- PCB Copper Thickness: 1 oz
- PCB Circuit Design: 3.5 mil / 3.3 mil
- PCB Applications: Industrial Computer Products, Network Communication Products
- Meets IPC-6012 Class 2/3 Requirements
C55-D006KSX
IPC Network Solutions PCB
- PCB Material Grade: Ultra Low Loss
- PCB Material Used: EM-890
- PCB Special Process: Back Drilling
- PCB Thickness: 2.4 MM
- PCB Copper Thickness: Special Copper Thickness
- PCB Circuit Design: 3.3 mil / 3.5 mil
- PCB Applications: Industrial Computer Products, Network Communication Products
- Meets IPC-6012 Class 2/3 Requirements
R10-8013VLX
Fiber Optic Switch PCB
- PCB Material Grade: Standard Loss
- PCB Material Used: NP-175F
- PCB Special Process: Vacuum Resin Via Plugging (VIP)
- PCB Thickness: 1.6 MM
- PCB Copper Thickness: 1 oz
- PCB Circuit Design: 4 mil / 4 mil
- PCB Applications: Network Communication Products
- Meets IPC-6012 Class 2/3 Requirements
R10-B014KCX
Fiber Optic Converter PCB
- PCB Material Grade: Very Low Loss
- PCB Material Used: TU-883
- PCB Special Process: Back Drilling
- PCB Thickness: 2.0 MM
- PCB Copper Thickness: Special Copper Thickness
- PCB Circuit Design: 4.0 mil / 3.7 mil
- PCB Applications: Network Communication Products
- Meets IPC-6012 Class 2/3 Requirements
Blood Glucose Meter PCB
- PCB Loss Level：Standard loss
- PCB Material：NP155/ EM-825 /TU-662.TU-668
- PCB Special SPEC：VIA IN PAD Epoxy Via Plug
- PCB Thickness：0.8 MM
- PCB Cu.：1 OZ
- PCB Trace：5/4.5MIL
- PCB Application：Blood Glucose Meter