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Industrial-grade Motherboard, A57-B007HCX

A57-B007HCX
Industrial-grade Motherboard
- PCB Material Grade: Upper Middle Loss
- PCB Material Selected: TU-862HF
- PCB Thickness: 1.8 MM
- PCB Copper Thickness: 1 oz
- PCB Circuit Design: 3.0 mil / 3.5 mil
- PCB Application: Networking and Communication Products
- Compliant with IPC-6012 Class 2/3 Standards
High-Speed Materials: Focused on data transmission rates, emphasizing low loss, low latency, and signal integrity (SI/PI).
\*Copper Foil Technology: HVLP, HVLP2, HVLP3, HVLP4 — the lower the roughness, the better the signal integrity.
High-Frequency Materials: Focused on RF and microwave signals at the GHz level and above, with key factors being low Dk / low Df, impedance stability, and low loss.
| Item | Specification |
| PCB Layers | 12L |
| PCB Material Grade | Upper middle loss |
| PCB Material | FR4 Halogen-free TG170 |
| PCB Material Options | TU-862HF -TU-865 -EM-370(D) -IT-180I/IT-168GR1 -NPG-170N/NPG170 -FR-406/Green Speed |
| HDI Level | - |
| PCB Special Process |
Halogen-free Substrate |
| PCB Thickness (Mil) | 70.86 |
| PCB Thickness (MM) | 1.8 MM |
| PCB Copper Thickness (OZ) | 1 oz |
| PCB Trace Design (MIL) | 3.0 mil / 3.5 mil |
| Surface Finish | ENIG |
| Optional Surface Finish | Gold Plating /ENIG (Electroless Nickel Immersion Gold) /Immersion Silver/ OSP (Organic Solderability Preservative) / HASL / Lead-free HASL (Hot Air Solder Leveling) / ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) |
| PCB Application |
Industrial-grade Motherboard |
| PCB Usage | Computing, Storage, and Peripherals |