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Embedded Single Board Computer (SBC), A57-C001KEG

A57-C001KEG
Embedded Single Board Computer (SBC)
- PCB Material Grade: Very low loss
- PCB Material Selection: TU-883A
- PCB Special Process: Back drilling
- PCB Thickness: 2.3 MM
- PCB Copper Thickness: 1 oz
- PCB Circuit Design: 3.5 mil / 3.4 mil
- PCB Application: Networking and communication products
- Meets IPC-6012 Class 2/3 Requirements
High-Speed Materials: Focused on data transmission rates, emphasizing low loss, low latency, and signal integrity (SI/PI).
\*Copper Foil Technology: HVLP, HVLP2, HVLP3, HVLP4 — the lower the roughness, the better the signal integrity.
High-Frequency Materials: Focused on RF and microwave signals above the GHz level, with key factors being low Dk / low Df, impedance stability, and low loss.
| Item | Specification |
| PCB Layers | 14L |
| PCB Material Grade | Ultra low loss |
| PCB Material | Halogen-free FR4 TG200 |
| PCB Material Options | TU-883A -TU-883(T2A) -EM-626 -IT-988G/IT-988GL -NPG-199 |
| HDI Level | - |
| PCB Special Process | Back Drill |
| PCB Thickness (Mil) | 90.55 |
| PCB Thickness (MM) | 2.3 MM |
| PCB Copper Thickness (OZ) | 1 oz |
| PCB Trace Design (MIL) | 3.5 mil / 3.4 mil |
| Surface Finish | OSP + Gold Fingers |
| Optional Surface Finish | Gold Plating /ENIG (Electroless Nickel Immersion Gold) /Immersion Silver/ OSP (Organic Solderability Preservative) / HASL / Lead-free HASL (Hot Air Solder Leveling) / ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) |
| PCB Application | Embedded Single Board Computer (SBC) |
| PCB Usage | Computing, Storage, and Peripherals |